Suppliers launch new semiconductor-integrated LiDAR chipsets and designs
Automotive Lidar Market 2025 to 2032: From Premium Adoption to Mass-Market Integration →Automotive LiDAR suppliers are focusing on semiconductor integration and miniaturization to improve scalability and integration into production platforms. In April 2026, RoboSense launched its Phoenix and Peacock chipsets based on its EOCENE SPAD SoC architecture. Additionally, Hesai Group introduced the ETX LiDAR designed for behind-the-windshield placement.
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Evaluate compact and chip-based LiDAR components for upcoming vehicle programs
Recent supplier developments in SoC architecture and behind-the-windshield designs offer opportunities to improve integration costs and scalability.
Source · globenewswire.com