Manufacturing · China · GB/T 4754-2017 C398

Electronic Component Manufacturing in China: Market Size, Businesses & Forecast 2026

The electronic component manufacturing industry in China encompasses the production of printed circuit boards, active and passive components, and specialized electronic materials essential for modern technology. The sector is steering rapidly toward high-end self-sufficiency, automotive electronics integration, and advanced packaging to reduce reliance on foreign supply chains. According to the Ministry of Industry and Information Technology (MIIT), China's electronic information manufacturing sector achieved substantial scale, generating 17.4 trillion yuan (approximately 2.5 trillion U.S. dollars) in operating revenue and yielding an integrated circuit output of 484.3 billion units in 2025.

Outlook
Growing
Competition
High, rising

Industry snapshot

Demand drivers
Automotive Electronics Transition
Domestic Technology Substitution
Consumer Electronics Volume
State Infrastructure Funding
Relative importance, Claight qualitative assessment.
Market structure
fragmented
moderate
concentrated
Competitive intensity
high, rising
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Key public data points

Electronic Information Manufacturing Operating Revenue (2025)17.4 trillion yuan
Source: Ministry of Industry and Information Technology (MIIT) 2025 Release
Electronic Information Manufacturing Total Profits (2025)750.9 billion yuan
Source: Ministry of Industry and Information Technology (MIIT) 2025 Release
National Integrated Circuit Production (2025)484.3 billion units
Source: Ministry of Industry and Information Technology (MIIT) 2025 Release
Smartphone Production Volume (2025)1.27 billion units
Source: Ministry of Industry and Information Technology (MIIT) 2025 Release
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Industry Definition and Scope

What does the Electronic Component Manufacturing in China industry cover?

The industry involves the research, design, and physical fabrication of electronic components used in telecommunications, consumer electronic devices, automotive applications, and industrial computing. It covers printed circuit boards (PCBs), semiconductor packaging substrates, sensors, and passive components such as capacitors and resistors. Under the national Chinese standards, these operations are classified under dedicated subsectors of the high-tech hardware segment.

  • Covers rigid, flexible, and rigid-flexible printed circuit boards (PCBs) utilized for electrical relay transmission across hardware platforms.
  • Includes specialized electronic materials and advanced packaging substrates critical for processing integrated circuits.
  • Categorized under the manufacturing of electronic components and special electronic materials within national economic activities.

Market Structure and Operators

Who operates in the industry and how is it structured?

The market features a tiered hierarchy of state-backed entities, massive domestic public manufacturers, and multinational joint ventures operating manufacturing facilities in regional technology hubs. Key clusters have formed in regions like East China (e.g., Shanghai) and South China, benefiting from dense local supply chain ecosystems. The industry has evolved structurally toward highly automated smart factories and digital workshops to enhance yield and precision.

  • Regional clusters in East China account for more than 25% of technology revenues due to a high density of advanced fabrication facilities.
  • Major facilities align under domestic and international partnerships to support local high-volume hardware brands.
  • Operators of 'designated size' (minimum annual revenue of 20 million yuan) form the core statistical pool monitored by national industry watchdogs.
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Demand Drivers

What drives demand in the industry?

Domestic demand is heavily driven by the high production volume of end-user electronic hardware, specifically consumer tech and electric vehicles. For instance, China produced 1.27 billion smartphones and 332 million units of microcomputer equipment in 2025, maintaining consistent pressure on the domestic component supply chain. Additionally, the expansion of local telecom infrastructure and advanced automotive systems requires complex, high-reliability power modules.

  • A total smartphone manufacturing volume of 1.27 billion units in 2025 represents a dominant source of high-volume demand.
  • Rapid expansion of smart vehicle production drives intense demand for battery monitoring flexible printed circuits and power modules.
  • The upgrade of telecom infrastructure toward advanced 5G/6G systems accelerates requirements for localized RF components and signal processors.

Competitive Landscape and Notable Public Companies

Who are the notable companies in the industry?

The market features fierce competition among dominant domestic leaders, alongside multinational manufacturers seeking local integration. Leading Chinese public companies command massive global market shares in specialized subsegments like PCBs, electronic connectors, and advanced packaging. These operators maintain close partnerships with major consumer electronic brands and domestic automotive giants.

  • Suzhou Dongshan Precision Manufacturing Co., Ltd. represents a leading global supplier of printed circuits and flexible electronics.
  • Luxshare Precision Industry Co., Ltd. operates as a highly integrated manufacturer of complex connectors, cables, and acoustic components.
  • Shennan Circuits Co., Ltd. provides advanced silicon packaging substrates and rigid multi-layer printed circuit boards.
  • BYD Semiconductor Co., Ltd. acts as a key vertically integrated supplier of automotive-grade power components and sensors.

Recent Trends and Outlook

What are the recent trends and outlook?

A primary industry trend is the continuous upgrade toward domestic substitution and localization in response to external export controls. Manufacturers are rapidly building capacity in advanced packaging nodes, Silicon Carbide (SiC) modules, and automotive-grade flexible boards. The industry is projected to maintain steady high-digit growth, outperforming standard manufacturing segments.

  • The value-added industrial output of the electronic information manufacturing sector rose 10.6 percent year on year in 2025.
  • Total profits for major electronic information manufacturing companies climbed 19.5 percent in 2025 to reach 750.9 billion yuan.
  • Strategic state funding, such as the Phase III National Integrated Circuit Industry Investment Fund, continues to accelerate capacity expansion in high-end components.
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Regulation and Compliance

How is the industry regulated?

Industrial compliance is strictly guided by national development plans, technical standards, and environmental protection guidelines. The Ministry of Industry and Information Technology (MIIT) enforces periodic growth stabilization plans to ensure production alignment. Facilities must comply with strict regional environmental impact assessments, hazardous substance controls, and standard national economic classifications.

  • Industrial installations must strictly match categories of national economic activity, such as C3982 for electronic circuit manufacturing.
  • Expansion projects are bound by regional Environmental Protection Bureau regulations to manage chemical processes involved in substrate etching.
  • Sector metrics are measured under the standards of the Industrial Classification for National Economic Activities (GB/T 4754-2017).

Sources

Government, statistical and trade sources used for this Claight analysis.

  • Ministry of Industry and Information Technology (MIIT) Official Announcements 2025-2026 ·
  • National Bureau of Statistics (NBS) of the People's Republic of China 2025-2026 ·
  • Industrial Classification for National Economic Activities (GB/T 4754-2017)

Claight analysis of public industry data.