DISCRETE
Light-Emitting Diodes (LEDs) — 3030 SMT Package
SMT LED packaging: wafer dicing, die attach, wire bonding, phosphor dispensing, silicone encapsulation, molding, singulation, testing and tape-and-reel packing · CN
Total Cost
$4.61 / unit
Capacity (units/year)
2,000,000,000
Throughput %
85%
Working capital
$25.0M Mn
Capex
$45.0M Mn
Offsite
$8.0M Mn
Total investment
$78.0M Mn
Lines
11
Net raw material
$0.04
0.8%
Conversion
$4.58
99.2%
Total / unit
$4.61
$ per unit
Raw Material
$0.04 / unit
| Line | Consumption | Unit | Price (USD) | Cost / unit |
|---|---|---|---|---|
| LED chip (GaN-on-sapphire die, fabricated) | piece | $0.04 | ||
| Phosphor and silicone encapsulant blendLive | kg | $0.00 | ||
| Lead frame / MCPCB substrate (copper base) | kg | $0.00 | ||
| Tape-and-reel packaging (HDPE carrier) | kg | $0.00 |
Utility
$0.05 / unit
| Line | Consumption | Unit | Price (USD) | Cost / unit |
|---|---|---|---|---|
| Electricity (cleanroom + equipment) | MWh | $0.05 | ||
| Nitrogen (inert atmosphere for封装) | m3 | $0.00 |
Operating
$4.50 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Assembly and test labor (die bond, wire bond, test) | $4.50 |
Overhead
$0.02 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Factory overhead (support labour, maintenance, consumables) | $0.01 | |
| SG&A allocation (sales, R&D, G&A) | $0.01 |
Depreciation
$0.00 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Equipment depreciation (die bonders, wire bonders, ATE, molding presses) | $0.00 |
Others
$0.01 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Quality assurance and yield loss allocation | $0.01 |
Prices stored in USD; converted to your selected currency at the latest ECB rate. Inputs marked "Live" pull current observed prices from Claight commodity data.