DISCRETE
LED A-Lamp (60W Equivalent, E26, 800 lm, 2700K)
LED wafer chip manufacture → SMT PCB assembly → driver circuit → housing/heat-sink injection molding → lens molding → base crimp/press-fit → final assembly → test → pack · CN
Total Cost
$4.24 / unit
Capacity (units/year)
10,000,000
Throughput %
85%
Working capital
$2.1M Mn
Capex
$18.0M Mn
Offsite
$0.00 Mn
Total investment
$20.1M Mn
Lines
14
Net raw material
$0.85
20.2%
Conversion
$3.38
79.8%
Total / unit
$4.24
$ per unit
Raw Material
$0.85 / unit
| Line | Consumption | Unit | Price (USD) | Cost / unit |
|---|---|---|---|---|
| LED chip/package (GaN-on-Sapphire) | piece | $0.39 | ||
| LED driver PCB (copper-clad laminate + components) | piece | $0.28 | ||
| Heat sink / housing aluminumLive | kg | $0.06 | ||
| Lens / optics polycarbonateLive | kg | $0.02 | ||
| E26 base (copper-brass alloy + nickel plate) | kg | $0.07 | ||
| Internal wiring & solder | kg | $0.03 |
Utility
$0.00 / unit
| Line | Consumption | Unit | Price (USD) | Cost / unit |
|---|---|---|---|---|
| Electricity (factory + HVAC) | kWh | $0.00 |
Operating
$3.00 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Assembly direct labor | $3.00 |
Overhead
$0.23 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Production overhead (factory indirect labor + supplies + maintenance) | $0.12 | |
| SG&A allocation (sales, admin, logistics) | $0.11 |
Depreciation
$0.03 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Depreciation (molding/assembly/test equipment amortized over 7 years) | $0.03 |
Others
$0.12 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Packaging (corrugated + paper insert + polybag) | $0.04 | |
| Quality / scrap / rework | $0.02 | |
| Factory margin / targeting | $0.06 |
Prices stored in USD; converted to your selected currency at the latest ECB rate. Inputs marked "Live" pull current observed prices from Claight commodity data.