DISCRETE
Central Processing Units
Wafer fabrication (12nm-class node, 300mm), flip-chip BGA/PGA assembly, probe and final test · US
Total Cost
$291 / unit
Capacity (units/year)
10,000,000
Throughput %
85%
Working capital
$125.0M Mn
Capex
$520.0M Mn
Offsite
$45.0M Mn
Total investment
$690.0M Mn
Lines
15
Net raw material
$15.34
5.3%
Conversion
$276
94.7%
Total / unit
$291
$ per unit
Raw Material
$15.34 / unit
| Line | Consumption | Unit | Price (USD) | Cost / unit |
|---|---|---|---|---|
| Silicon wafer (300mm, N12-class) | piece | $0.00 | ||
| Integrated circuit die | piece | $4.84 | ||
| Organic substrate (flip-chip BGA) | piece | $10.50 | ||
| Cu ribbon / solder bumps (interconnect) | g | $0.00 | ||
| 封装 molding compound (encapsulant) | g | $0.00 |
Utility
$2.95 / unit
| Line | Consumption | Unit | Price (USD) | Cost / unit |
|---|---|---|---|---|
| Factory electricity (fab + assembly)Live | kWh | $2.95 |
Operating
$85.60 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Wafer fabrication cost | $66.10 | |
| Assembly, package, and final test | $19.50 |
Overhead
$8.50 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Factory overhead (buildings, equipment, HSE) | $8.50 |
Depreciation
$5.30 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| Depreciation (fab equipment, tooling, packaging lines) | $5.30 |
Others
$174 / unit
| Line | Price (USD) | Cost / unit |
|---|---|---|
| IP / architecture licensing (ARM / x86 amortized) | $17.00 | |
| Yield loss allocation (N12 defect density) | $89.67 | |
| R&D and product validation | $19.10 | |
| SG&A and margin | $38.20 | |
| Distributor / fulfillment margin | $9.55 |
Prices stored in USD; converted to your selected currency at the latest ECB rate. Inputs marked "Live" pull current observed prices from Claight commodity data.